Title :
The Improvement of Sweep Stiffness and Thermomechanical Properties of Wire Bonds for Pure Gold Wire with Dopant
Author :
Kung, Huang-Kuang ; Chen, Hung-Shyong ; Lee, Jeng-Nan ; Sun, Yun-Ping
Author_Institution :
Cheng Shiu Univ., Kaohsiung
Abstract :
The materials used in this study were three types of gold wire: SR-Y, high-loop wire; FA type, middle-loop wire; and GL-2, low-loop wire. All of these wires are composed of high-purity gold with various dopants added to obtain greater strength and stiffness. The three types of gold wire are gold alloys of 99.99% purity with less than 100 ppm of non-gold dopants. The major difference among these three types of wires is the concentration of calcium dopant: SR-Y, 1 ppm; FA, 6 ppm; and GL-2, 24 ppm. The effects of a calcium dopant on the thermomechanical properties of three types of gold-bonding wires were investigated. The sweep stiffness were measured for various bond spans and bond heights of three types of wire and was shown to increase with increased concentration of calcium.
Keywords :
calcium; elasticity; gold; integrated circuit bonding; integrated circuit packaging; lead bonding; wires; Au:Ca; FA type middle-loop wire; GL-2 low-loop wire; SR-Y high-loop wire; calcium dopant concentration; gold wire; sweep stiffness; thermomechanical properties; wire bonds; Bonding; Calcium; Electronics packaging; Gold alloys; Microelectronics; Semiconductor device packaging; Temperature; Testing; Thermomechanical processes; Wire;
Conference_Titel :
Electronics Packaging Technology Conference, 2007. EPTC 2007. 9th
Conference_Location :
Singapore
Print_ISBN :
978-1-4244-1323-2
Electronic_ISBN :
978-1-4244-1323-2
DOI :
10.1109/EPTC.2007.4469703
