DocumentCode :
3160447
Title :
2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220)
fYear :
2001
fDate :
May 29 2001-June 1 2001
Abstract :
This international conference attempts to bring together the best in packaging, components, microelectronic systems science, technology and education in an environment of cooperation and technical exchange. The technical sessions focus on leading edge developments and technical innovations in several areas, including: optoelectronics, advanced packaging technologies, high performance package design, simulation and manufacturing, interconnections and reliability
Keywords :
packaging; education; electronic components; interconnections; manufacturing processes; microelectronic systems; numerical simulation; optoelectronics; package design; packaging technology; reliability;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components and Technology Conference, 2001. Proceedings., 51st
Conference_Location :
Orlando, FL, USA
ISSN :
0569-5503
Print_ISBN :
0-7803-7038-4
Type :
conf
DOI :
10.1109/ECTC.2001.927619
Filename :
927619
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=3160447
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