DocumentCode :
3160482
Title :
Laser Hammering Technique in Butterfly Laser Diode Module
Author :
Kuang, Jao-Hwa ; Hung, Tsung-Pin
Author_Institution :
Nat. Sun Yat-Sen Univ., Kaohsiung
fYear :
2007
fDate :
10-12 Dec. 2007
Firstpage :
874
Lastpage :
881
Abstract :
The laser hammering technique on the coupling efficiency improvement in a lensed fiber butterfly laser diode module is studied in this work. The post weld shift (PWS) introduced from laser hammering technique is used to compensate the fiber alignment shift after laser welding in the packaging process. A wedge shaped lensed fiber was used in the coupling efficiency analysis of a 980 nm wavelength laser pumping signal. The 3D thermal-elastic-plastic finite element model was proposed to simulate the laser welding and solidification process by employing the MARC finite element package. The temperature dependent material properties were used in the FEM analysis. The commercial optical software, i.e. Zemax, was also employed in laser power coupling efficiency simulation. The effects of laser pulse sequence and power distribution on coupling efficiency improvement were discussed. The results showed that the proper laser hammering sequence combined with the proper pulse power distribution can improve the coupling efficiency significantly. The results also indicate that the proposed finite element model can simulate the fiber alignment shift induced by PWS in laser welding qualitatively and develop a design guideline for manufacturing laser module packages.
Keywords :
electronic engineering computing; electronics packaging; finite element analysis; laser beam welding; production engineering computing; semiconductor lasers; 3D thermal-elastic-plastic finite element model; MARC finite element package; coupling efficiency analysis; coupling efficiency improvement; fiber alignment shift; laser hammering technique; laser welding; lensed fiber butterfly laser diode module; packaging process; post weld shift; wedge shaped lensed fiber; Diode lasers; Fiber lasers; Finite element methods; Laser modes; Optical coupling; Packaging; Power lasers; Pump lasers; Solid modeling; Welding;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics Packaging Technology Conference, 2007. EPTC 2007. 9th
Conference_Location :
Singapore
Print_ISBN :
978-1-4244-1323-2
Electronic_ISBN :
978-1-4244-1323-2
Type :
conf
DOI :
10.1109/EPTC.2007.4469710
Filename :
4469710
Link To Document :
بازگشت