Reinforcement study on photosensitive resin´s toughness with SiC whiskers

Stereolithography (SL) is the most widely used rapid prototyping technology and a key issue of the technology is in turn the development of molding material-photosensitive resins. Prepolymer of photosensitive resins-epoxy acrylate were synthesized with matching monoter-TMPTA and photoiniator-ITX, both selected according to SL craft demands for photosensitive resins and solidification mechanism of photosensitive resins. The mechanical behaviors of the developed photosensitive resins are not quite up to the requirements as expected, however. To overcome the existent shortcomings, an experiment was made to modify the material by reinforcing toughness with surface treated silane resin acceptor SiC whisker. A contrast between modified and unmodified materials in their micro structure, tensile strength and micro hardness shows a marked improvement in mechanical property of modified photosensitive resins.