Board-level Reliability of Package-on-Package Stacking Assemblies Subjected to Coupled Power and Thermal Cycling Tests

In this work, the sequential thermal-mechanical coupling analysis, which solves in turn the transient temperature field and subsequent thermomechanical deformations, is performed to investigate thermal characteristics along with fatigue reliability of a board-level package-on-package (PoP) stacking assembly under coupled power and thermal cycling test conditions. Effects of powering sequences on thermal characteristics and fatigue reliability of the PoP are examined.