Characterisation of TFMS and CPW Lines and Interconnections up to 100 GHz in Multilayer Photoimageable Thick Film Technology

Author

Samanta, K.K. ; Robertson, I.D.

Author_Institution

Sch. of Electron. & Electr. Eng., Leeds Univ.

fYear

2006

fDate

10-15 Sept. 2006

Firstpage

376

Lastpage

379

Abstract

This paper describes the characterisation of a photoimageable multilayer thick film process up to 100 GHz using a side-coupled TFMS linear microstrip resonator. The technique yields more consistent results than previous ring resonator work. The TFMS and CPW transmission lines and wideband layer to layer transition are also characterised up to 100 GHz for multilayer MCM application. Up to 80 GHz the TFMS and CPW lines exhibit low loss of <0.25dB/mm and the layer-to-layer transitions demonstrate extremely low loss of < 0.1dB. This performance is better than many reported results for thin film technology

Keywords

coplanar waveguides; integrated circuit interconnections; microstrip lines; microstrip resonators; multichip modules; thick films; CPW transmission lines; TFMS transmission lines; coplanar waveguides; interconnections; linear microstrip resonator; microstrip lines; multichip modules; multilayer MCM application; multilayer photoimageable thick film; wideband layer; Coplanar waveguides; Dielectric losses; Dielectric materials; Dielectric thin films; Feeds; Frequency measurement; Microstrip resonators; Nonhomogeneous media; Space technology; Thick films; Microstrip lines; coplanar waveguides; multichip modules;

fLanguage

English

Publisher

ieee

Conference_Titel

Microwave Conference, 2006. 36th European

Conference_Location

Manchester

Print_ISBN

2-9600551-6-0

Type

conf

DOI

10.1109/EUMC.2006.281352

Filename

4057828