DocumentCode :
3160908
Title :
A Higher Gradient Theory of Multiphase Solid Mixtures and its Application to Lead-Free Solder Micro-Morphology
Author :
Müller, Wolfgang H. ; Weinberg, Kerstin ; Böhme, Thomas
Author_Institution :
Tech. Univ. Berlin, Berlin
fYear :
2007
fDate :
10-12 Dec. 2007
Firstpage :
152
Lastpage :
160
Abstract :
In order to analyze the micro-morphology evolution in today´s (lead-free) solders we present a theory of multi- component heterogeneous solid mixtures based on fundamental thermodynamic principles. We derive an extended diffusion equation, which allows to predict the diffusion-induced phase separation and coarsening process within solids under the presence of local (thermo-)mechanical strains on a theoretical basis. As an example we specialize to the lead-free binary case study alloy Ag-Cu and simulate the spinodal decomposition and coarsening process. We end with a model for the formation and growth of pores within the solder material, which is particularly driven by the so-called Kirkendall effect in the different phases of the composite material.
Keywords :
chemical interdiffusion; composite materials; copper alloys; phase separation; silver alloys; solders; spinodal decomposition; thermodynamics; Ag-Cu; Kirkendall effect; coarsening process; composite material; diffusion-induced phase separation; extended diffusion equation; fundamental thermodynamic principles; higher gradient theory; lead-free solder micromorphology; multicomponent heterogeneous solid mixtures; multiphase solid mixtures; solder material; spinodal decomposition; Composite materials; Electrical equipment industry; Electrical products industry; Electronics industry; Environmentally friendly manufacturing techniques; Industrial electronics; Lead; Microelectronics; Phase change materials; Solids;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics Packaging Technology Conference, 2007. EPTC 2007. 9th
Conference_Location :
Singapore
Print_ISBN :
978-1-4244-1323-2
Electronic_ISBN :
978-1-4244-1323-2
Type :
conf
DOI :
10.1109/EPTC.2007.4469733
Filename :
4469733
Link To Document :
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