Novel Co-Simulation Method for Analysis of Power Integrity and EMI in Electronic Packages with Large Number of Power/ground Vias

A novel co-simulation method for signal traces with large number of vertical power/ground vias in electronic package using a coupled scattering matrix method (SMM) with integral equation (IE) method is presented. The SMM for the parallel- plate waveguide modes is developed using the Foldy-Lax equations to analyze the scattering effects between the P/G vias. Two-port admittance (Y) matrix is modeled to represent multiple scattering of the P/G vias with signal vias. The IE method is used to extract equivalent circuit models for coupling between external signal traces and the vertical vias. The extracted model is co-simulated with the Y-matrix for signal response.