• DocumentCode
    3161349
  • Title

    Variable Frequency Microwave Curing of Polymer Materials in Microelectronics Packaging Applications

  • Author

    Tilford, T. ; Sinclair, K.I. ; Goussetis, G. ; Bailey, C. ; Desmulliez, M.P.Y. ; Parrott, A.K. ; Sangster, A.J.

  • Author_Institution
    Univ. of Greenwich, London
  • fYear
    2007
  • fDate
    10-12 Dec. 2007
  • Firstpage
    791
  • Lastpage
    796
  • Abstract
    The use of variable frequency microwave technology in curing of polymer materials used in microelectronics applications is discussed. A revolutionary open-ended microwave curing system is outlined and assessed using experimental and numerical approaches. Experimental and numerical results are presented, demonstrating the feasibility of the system.
  • Keywords
    curing; electronics packaging; polymers; microelectronics packaging; open-ended microwave curing system; polymer materials; variable frequency microwave curing; Conducting materials; Curing; Dielectric materials; Electromagnetic heating; Frequency; Microelectronics; Microwave ovens; Microwave technology; Packaging; Polymers;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics Packaging Technology Conference, 2007. EPTC 2007. 9th
  • Conference_Location
    Singapore
  • Print_ISBN
    978-1-4244-1323-2
  • Electronic_ISBN
    978-1-4244-1323-2
  • Type

    conf

  • DOI
    10.1109/EPTC.2007.4469757
  • Filename
    4469757
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3161349