Title :
Variable Frequency Microwave Curing of Polymer Materials in Microelectronics Packaging Applications
Author :
Tilford, T. ; Sinclair, K.I. ; Goussetis, G. ; Bailey, C. ; Desmulliez, M.P.Y. ; Parrott, A.K. ; Sangster, A.J.
Author_Institution :
Univ. of Greenwich, London
Abstract :
The use of variable frequency microwave technology in curing of polymer materials used in microelectronics applications is discussed. A revolutionary open-ended microwave curing system is outlined and assessed using experimental and numerical approaches. Experimental and numerical results are presented, demonstrating the feasibility of the system.
Keywords :
curing; electronics packaging; polymers; microelectronics packaging; open-ended microwave curing system; polymer materials; variable frequency microwave curing; Conducting materials; Curing; Dielectric materials; Electromagnetic heating; Frequency; Microelectronics; Microwave ovens; Microwave technology; Packaging; Polymers;
Conference_Titel :
Electronics Packaging Technology Conference, 2007. EPTC 2007. 9th
Conference_Location :
Singapore
Print_ISBN :
978-1-4244-1323-2
Electronic_ISBN :
978-1-4244-1323-2
DOI :
10.1109/EPTC.2007.4469757
