Title :
Properties of new solder paste system with ultra low residue for Die Attach and DCB
Author :
Schmitt, Wolfgang ; Davies, Jason ; Ping, Sim Tiow
Author_Institution :
W.C. Heraeus GmbH, Hanau
Abstract :
Since the beginning of the SMT process solder pastes have been developed and manufactured on the basis of resins/rosins. Due to problems caused by residues in the SMT and Semiconductor applications it was decided to develop an ultra low residue solder paste.
Keywords :
beams (structures); cantilevers; microassembling; reflow soldering; resins; semiconductor technology; solders; surface mount technology; DCB; SMT process solder pastes; die attach; double cantilever beams; resins; rosins; semiconductor applications; ultra low residue solder paste; Microassembly; Powders; Resins; Rheology; Soldering; Stability; Surface-mount technology; System testing; Temperature; Viscosity;
Conference_Titel :
Electronics Packaging Technology Conference, 2007. EPTC 2007. 9th
Conference_Location :
Singapore
Print_ISBN :
978-1-4244-1323-2
Electronic_ISBN :
978-1-4244-1323-2
DOI :
10.1109/EPTC.2007.4469761
