Title :
An accelerated reliability test method to predict thermal grease pump-out in flip-chip applications
Author :
Chiu, Chia-Pin ; Chandran, Biju ; Mello, Mike ; Kelley, Ken
Author_Institution :
Assembly & Technol. Dev., Intel Corp., Chandler, AZ, USA
Abstract :
In packages using thermal grease as the conducting medium between the die and the thermal solution, grease pump-out during operation of the part is a known failure mechanism. Traditional power cycle test is a direct method to examine grease reliability. However, it is a time consuming process due to its long heating and cooling times. In order to screen numerous thermal grease materials during the initial design phase of a microprocessor package, it is advantageous to utilize a quick turn test. This paper describes an accelerated mechanical test, developed to evaluate interface degradation, due to pump-out. An MTS(R) universal testing machine is used to simulate the squeezing action on the grease, caused by die warpage change. By using this accelerated testing method, product design cycle time can be significantly reduced. In this paper, a silicone-oil-based AlN-filled thermal grease with different thickness at the corresponding device operation temperature is examined by using this accelerated test method. Results from this test are also compared to traditional power cycle test results
Keywords :
flip-chip devices; integrated circuit packaging; life testing; reliability; AlN-filled silicone oil; MTS universal testing machine; accelerated reliability testing; failure mechanism; flip-chip package; microprocessor; power cycle testing; product design cycle time; thermal grease pump-out; thermal interface material; Cooling; Failure analysis; Heating; Life estimation; Materials testing; Microprocessors; Packaging machines; Pumps; Thermal conductivity; Thermal degradation;
Conference_Titel :
Electronic Components and Technology Conference, 2001. Proceedings., 51st
Conference_Location :
Orlando, FL
Print_ISBN :
0-7803-7038-4
DOI :
10.1109/ECTC.2001.927696