DocumentCode
3161620
Title
90 Degree Tandem Hybrid with Tolerance to Displacement Error and Thickness Variation in Multi-layered Substrate
Author
Yuasa, Takeshi ; Tahara, Yukihiro ; Oh-hashi, Hideyuki
Author_Institution
Mitsubishi Electr. Corp., Kamakura
fYear
2006
fDate
10-15 Sept. 2006
Firstpage
534
Lastpage
536
Abstract
90 degree coupled-line hybrid that is tolerant to manufacturing errors in a multi-layered substrate has been developed. The tolerance to displacement error and thickness variation in the multi-layered substrate can be achieved by using diagonally shifted coupled lines with adjacent ground walls. It has been demonstrated that the coupling characteristics of the hybrids fabricated in LTCC agree well with designed ones and their deviation is very small
Keywords
ceramic packaging; hybrid integrated circuits; integrated circuit packaging; substrates; LTCC; coupled-line hybrid; diagonally shifted coupled lines; displacement error; multilayered substrate; tandem hybrid; thickness variation; Circuit optimization; Conductors; Coupling circuits; Degradation; Dielectric losses; Dielectric substrates; Manufacturing; Production; Radio frequency; Strips; error; hybrid; multi-layered substrate;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave Conference, 2006. 36th European
Conference_Location
Manchester
Print_ISBN
2-9600551-6-0
Type
conf
DOI
10.1109/EUMC.2006.281428
Filename
4057869
Link To Document