DocumentCode :
3161798
Title :
Over GHz low-power RF clock distribution for a multiprocessor digital system
Author :
Ryu, Woonghwan ; Wai, Albert Lu Chee ; Wei, Fan ; Lai, Wai Lai ; Kim, Joungho
Author_Institution :
Dept. of Electr. Eng., Korea Adv. Inst. of Sci. & Technol., Taejon, South Korea
fYear :
2001
fDate :
2001
Firstpage :
133
Lastpage :
140
Abstract :
Conventional digital clock distribution interconnection causes a severe power consumption problem for GHz clock distribution because of transmission line losses, and it exhibits difficult signal integrity problems due to clock skew, clock jitter and signal reflection. To overcome these conventional digital clock distribution limitations, optical clock distribution techniques, based on guided-wave optics and free-space optics, have been proposed. However, the optical clock distribution is found to be bulky, hard to fabricate, and expensive, even though it has lower power consumption and excellent signal integrity properties. Therefore, we have proposed an RF clock distribution (RCD) scheme for high-speed digital applications, especially multi-processor systems using global clocking. In this paper, we firstly report signal integrity analysis including power, skew, jitter, crosstalk, reflection, and noise in the RF clock distribution system. Based on this analysis, we propose a novel signal integrity design methodology for the RF clock distribution. The system comprises an RF clock transmitter as a clock generator, an H clock tree with junction couplers as a clock distributing network and an RF receiver as a digital clock-recovering module. We assume solder-ball flip chip interconnects for the chip-to-substrate assembly and 0.35 μm TSMC CMOS technology for the RF clock receiver. The clock skew and the clock jitter created by process parameter variations or modeled and predicted. Finally, we demonstrate the RCD as a low-power and high-performance clocking method using HP Advanced Design System (ADS) simulation considering the microwave frequency interconnection models and the process parameter variations
Keywords :
CMOS digital integrated circuits; clocks; crosstalk; flip-chip devices; high-speed integrated circuits; integrated circuit noise; low-power electronics; microprocessor chips; multiprocessing systems; timing jitter; trees (mathematics); 0.35 micron; H-tree; HP Advanced Design System; RF clock distribution; RF receiver; RF transmitter; TSMC CMOS technology; chip-to-substrate assembly; clock jitter; clock skew; crosstalk; global clocking; high-speed low-power design; microwave frequency model; multiprocessor digital system; noise; signal integrity; signal reflection; solder-ball flip-chip interconnect; transmission line loss; Clocks; Energy consumption; High speed optical techniques; Jitter; Optical crosstalk; Optical interconnections; Optical receivers; Optical reflection; Optical transmitters; Radio frequency;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components and Technology Conference, 2001. Proceedings., 51st
Conference_Location :
Orlando, FL
ISSN :
0569-5503
Print_ISBN :
0-7803-7038-4
Type :
conf
DOI :
10.1109/ECTC.2001.927708
Filename :
927708
Link To Document :
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