• DocumentCode
    3161841
  • Title

    Grain boundary modeling and characterization of thin-film silicon solar cells

  • Author

    Sproul, A.B. ; Edmiston, S.A. ; Puzzer, T. ; Heiser, G. ; Wenham, S.R. ; Green, M.A. ; Young, T.L.

  • Author_Institution
    Centre for Photovoltaic Devices & Syst., New South Wales Univ., Sydney, NSW, Australia
  • fYear
    1996
  • fDate
    13-17 May 1996
  • Firstpage
    549
  • Lastpage
    552
  • Abstract
    An analytical model is developed to describe recombination currents arising from recombination at grain boundaries (GBs) in the depletion region of a p-n junction solar cell. Grain boundaries are modeled as having a single energy level in the energy gap, and partial occupancy of these states gives rise to a charge on the GB. The analytical model is compared to a complete numerical simulation package (DESSIS) and found to be in good agreement. Additionally, cross sectional EBIC images of a multilayer device containing vertical GBs are presented. Results derived from an analytical model are compared qualitatively to the experimental data and found to give good agreement
  • Keywords
    EBIC; electron-hole recombination; elemental semiconductors; energy gap; grain boundaries; p-n junctions; semiconductor materials; semiconductor thin films; silicon; solar cells; DESSIS; Si; Si solar cells; cross sectional EBIC images; depletion region; energy gap; grain boundary modeling; multilayer device; numerical simulation package; p-n junction solar cell; recombination currents; single energy level; thin-film silicon solar cells; vertical grain boundaries; Analytical models; Energy states; Grain boundaries; Nonhomogeneous media; Numerical simulation; P-n junctions; Packaging; Photovoltaic cells; Semiconductor thin films; Silicon;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Photovoltaic Specialists Conference, 1996., Conference Record of the Twenty Fifth IEEE
  • Conference_Location
    Washington, DC
  • ISSN
    0160-8371
  • Print_ISBN
    0-7803-3166-4
  • Type

    conf

  • DOI
    10.1109/PVSC.1996.564065
  • Filename
    564065