Title :
Better Tooling Design and Effective Parameter Optimization for Successful transfer MUF of Flip Chips packages
Author :
Kanth, K.R. ; Paghasian, K.Y. ; Retuta, D. ; Toh, Chin Hock ; Tanary, S. ; Tan Hian Boon
Author_Institution :
United Test & Assembly Center Ltd, Singapore
Abstract :
This paper show cases various tooling strategies that can be taken up in building a vacuum chase for moldable under-fill (MUF) of flip chip packages, (SIP) system in package and molding other advanced stacked die packages. Various MUF mold compounds are evaluated, which have shown good MSL#3 results. The tooling developed is successfully used in the qualification MUF flip chip packages, stacked die FBGA packages and SIP with IR shields. Finally the paper discusses critical mold parameters, their effect on MUF molding and MSL#3 results.
Keywords :
ball grid arrays; chip scale packaging; electromagnetic shielding; fine-pitch technology; flip-chip devices; integrated circuit design; integrated circuit interconnections; system-in-package; transfer moulding; IR shields; critical mold parameters; effective parameter optimization; flip chips packages; stacked die FBGA packages; system in package; tooling strategies; transfer moldable under-fill mold compounds; vacuum chase; Assembly systems; Costs; Design optimization; Electronics packaging; Flip chip; Laminates; Qualifications; Strips; System testing; Vacuum systems;
Conference_Titel :
Electronics Packaging Technology Conference, 2007. EPTC 2007. 9th
Conference_Location :
Singapore
Print_ISBN :
978-1-4244-1323-2
Electronic_ISBN :
978-1-4244-1323-2
DOI :
10.1109/EPTC.2007.4469790
