Femtosecond micromachining applications for electro-optic components

Author

Leong, K.H. ; Said, A.A. ; Maynard, R.L.

Author_Institution

Electro-Opt. Center, Penn State Appl. Res. Lab., Kittanning, PA, USA

fYear

2001

fDate

2001

Firstpage

210

Lastpage

214

Abstract

This paper investigates applications of femtosecond lasers in the improved manufacturing of microelectronic and electrooptic components. It examines the requirements for a precision laser micromachining system and discusses the capability of a commercially available laser systems to micromachine feature sizes from 1 mm down to submicron depths for a variety of materials including ceramics, metals, polymers and transparent materials. The precise nature of the ablation process can be utilized to carry out precision shaping of microfeatures for a particular application. Aspect ratios of 100 μm smooth holes obtained can be greater than 10. No post processing is required and the substrate is unaffected

Keywords

electro-optical devices; laser ablation; micromachining; ablation process; aspect ratios; electro-optic components; feature sizes; femtosecond lasers; femtosecond micromachining applications; precision laser micromachining system; precision shaping; submicron depths; Ceramics; Inorganic materials; Laser ablation; Laser applications; Lasers and electrooptics; Microelectronics; Micromachining; Optical materials; Polymers; Pulp manufacturing;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 2001. Proceedings., 51st

Conference_Location

Orlando, FL

ISSN

0569-5503

Print_ISBN

0-7803-7038-4

Type

conf

DOI

10.1109/ECTC.2001.927720

Filename

927720