Failure Mechanisms of Dummy IGBT Assembles Constructed using Liquid In-Sn/Nb System

Author

Li, Jianfeng ; Sarvar, Farhad ; Whalley, David C. ; Hutt, David A. ; Clode, Mike P. ; Mannan, Samjid H.

Author_Institution

King´´s Coll. London, London

fYear

2007

fDate

10-12 Dec. 2007

Firstpage

43

Lastpage

46

Abstract

Liquid solder joints have previously been proposed in order to improve the reliability of solder joints in general, and especially for those that are operated at elevated temperatures. The solder is designed to melt during high temperature operation, releasing the stresses on the joint. The component will remain mechanically attached to the substrate by use of a polymer underfill or glob-top. Assemblies of dummy insulated gate bipolar transistor (IGBT) devices were constructed using the In-Sn as a low melting point solder and Nb as a barrier layer, on both device bond pads and connecting wires. Silicone and epoxy based adhesives were used as glob top materials, and alumina was used as the substrate. Thermal cycling carried out between -20 and +125 degC lead to rapid joint failure, and analysis of the joints showed that the wires had moved under mechanical tests. Further testing is underway.

Keywords

adhesives; alumina; failure analysis; filled polymers; indium alloys; insulated gate bipolar transistors; liquid alloys; mechanical testing; niobium alloys; semiconductor device reliability; silicones; solders; thermal analysis; tin alloys; Al₂O₃; In-Sn-Nb; alumina; dummy IGBT assembly; dummy insulated gate bipolar transistor devices; epoxy based adhesives; failure mechanisms; high temperature operation; liquid solder joints; liquid system; mechanical tests; polymer underfills; silicone; solder joint reliability; stress release; temperature -20 C to 125 C; thermal cycling; Assembly systems; Failure analysis; Insulated gate bipolar transistors; Niobium; Polymers; Soldering; Stress; Temperature; Testing; Wires;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Packaging Technology Conference, 2007. EPTC 2007. 9th

Conference_Location

Singapore

Print_ISBN

978-1-4244-1323-2

Electronic_ISBN

978-1-4244-1323-2

Type

conf

DOI

10.1109/EPTC.2007.4469799

Filename

4469799