Recent Advancement in Characterization, Modeling and Correlation for Power Distribution Network of FPGA and Structural ASIC Packages and Devices

Author

Shi, Hong ; Low, Hoon Ngik ; Yew, Yeehuan

Author_Institution

Altera Corp., San Jose

fYear

2007

fDate

10-12 Dec. 2007

Firstpage

136

Lastpage

139

Abstract

This paper discusses recent progress made in power distribution network (PDN) characterization, modeling and hardware-to-model correlation in Altera. A complete methodology and process are introduced for accurate PDN measurement and associated equivalent RLC parameter extraction. The proposed method is validated through modeling and measurement correlation and believed to be beneficial to system users in FPGA and ASIC field.

Keywords

RLC circuits; application specific integrated circuits; equivalent circuits; field programmable gate arrays; integrated circuit design; integrated circuit modelling; integrated circuit packaging; Altera; FPGA; PDN characterization; equivalent RLC parameter extraction; hardware-to-model correlation; power distribution network; structural ASIC packages; Application specific integrated circuits; Equivalent circuits; Field programmable gate arrays; Impedance measurement; Inductance; Packaging; Power system modeling; Power systems; Testing; Voltage;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Packaging Technology Conference, 2007. EPTC 2007. 9th

Conference_Location

Singapore

Print_ISBN

978-1-4244-1323-2

Electronic_ISBN

978-1-4244-1323-2

Type

conf

DOI

10.1109/EPTC.2007.4469802

Filename

4469802