Ag Content Effect on Mechanical Properties of Sn-xAg-0.5Cu Solders

Author

Che, F.X. ; Poh, Edith Candy ; Zhu, W.H. ; Xiong, B.S.

Author_Institution

United Test & Assembly Center Ltd., Singapore

fYear

2007

fDate

10-12 Dec. 2007

Firstpage

713

Lastpage

718

Abstract

In this work, the Ag content effect on material properties of Sn-xAg-0.5Cu solders was investigated based on tensile test for bulk solder. In this study, three different Ag contents including 1%, 2% and 3% Ag in Sn-xAg-0.5Cu solder were investigated. The material properties, such as elastic modulus, UTS (ultimate tensile strength) and yield stress were evaluated for different Ag content bulk solder. In addition, the strain rate effect on material properties of Sn-xAg-0.5Cu solder was also investigated considering 5 different strain rates from 10^-5 to 10^-1. Results show that the elastic modulus, yield stress and UTS of Sn-xAg-0.5Cu solder increase with Ag content. The relationships of strain rate, Ag content and material properties were developed and material constants in curve fitting equations were presented.

Keywords

copper alloys; curve fitting; elastic moduli; integrated circuit reliability; silver alloys; solders; tensile strength; tensile testing; tin alloys; yield stress; SnAgCu; UTS; bulk solders; curve fitting equations; elastic modulus; material constants; material properties; mechanical properties; microelectronic assembly reliability; silver content effects; strain rate effect; tensile test; ultimate tensile strength; yield stress; Assembly; Capacitive sensors; Environmentally friendly manufacturing techniques; Fatigue; Lead; Material properties; Materials testing; Mechanical factors; Soldering; Tensile stress;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Packaging Technology Conference, 2007. EPTC 2007. 9th

Conference_Location

Singapore

Print_ISBN

978-1-4244-1323-2

Electronic_ISBN

978-1-4244-1323-2

Type

conf

DOI

10.1109/EPTC.2007.4469808

Filename

4469808