Title :
A novel fractal PCB power plane for power integrity in high speed mixed signal system
Author :
Huang, HuiFen ; Chu, QingXin ; Xie, ZeMing ; Xiao, JianKang
Author_Institution :
Sch. of Electron. & Inf. Eng., South China Univ. of Technol., Guangzhou, China
Abstract :
In this paper, a novel fractal PCB power plane based on leaf vein fractal structure is developed. The technique introduced here not only provide noise suppression over a wide range of frequencies, but also improve IR drop and Swiss Chess structure effect (high resistance metal areas because of distributed vias and solders and leading to the voltages or currents to the circuit - elements lower than design demand).
Keywords :
fractals; integrated circuit design; microwave integrated circuits; mixed analogue-digital integrated circuits; printed circuit design; IR drop; Swiss Chess structure; distributed vias; fractal PCB power plane; high speed mixed signal system; leaf vein fractal structure; power integrity; solders; Animal structures; Circuit noise; Fractals; Frequency; Lead; Metamaterials; Periodic structures; Power engineering and energy; Veins; Voltage; IR drop; SSN; Swiss Chess structure effect; fractal; power integrity;
Conference_Titel :
Microwave Conference, 2009. APMC 2009. Asia Pacific
Conference_Location :
Singapore
Print_ISBN :
978-1-4244-2801-4
Electronic_ISBN :
978-1-4244-2802-1
DOI :
10.1109/APMC.2009.5384132
