DocumentCode :
3162493
Title :
Pull Force and Tail Breaking Force Optimization of the Crescent Bonding Process with Insulated Au Wire
Author :
Lee, J. ; Mayer, M. ; Zhou, Y. ; Persic, J.
Author_Institution :
Microjoining Lab, Markham
fYear :
2007
fDate :
10-12 Dec. 2007
Firstpage :
725
Lastpage :
730
Abstract :
Strong crescent bond and strong tail bond are crucial for maintaining reliability and bondability of the wire bond and stability of the bonding process, respectively. This study investigates the optimization of tail breaking force and pull force of the crescent bond with insulated X-WireTM. The pull force and the tail breaking force are individually optimized by an iteration method. The results are compared with the results of bare Au wire. Ultrasonic power which is a measure of ultrasonic amplitude, combined with a cleaning stage during bonding plays a significant role in initiating the removal of the insulated layer of X-WireTM during the crescent bonding process. The pull force and the tail breaking force of insulated X-WireTM are 91.4 plusmn 11.78 mN and 59.15 plusmn 5.35 mN, comparable to those of bare Au wire.
Keywords :
bonding processes; gold; reliability; wires; Au; X-WireTM; bondability; crescent bonding process stability; insulated gold wire; iteration method; pull force; tail bond; tail breaking force optimization; ultrasonic amplitude; ultrasonic power; wire bond reliability; Bonding forces; Bonding processes; Cable insulation; Gold; Maintenance; Optimization methods; Power measurement; Stability; Tail; Wire;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics Packaging Technology Conference, 2007. EPTC 2007. 9th
Conference_Location :
Singapore
Print_ISBN :
978-1-4244-1323-2
Electronic_ISBN :
978-1-4244-1323-2
Type :
conf
DOI :
10.1109/EPTC.2007.4469818
Filename :
4469818
Link To Document :
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