Pull Force and Tail Breaking Force Optimization of the Crescent Bonding Process with Insulated Au Wire

Author

Lee, J. ; Mayer, M. ; Zhou, Y. ; Persic, J.

Author_Institution

Microjoining Lab, Markham

fYear

2007

fDate

10-12 Dec. 2007

Firstpage

725

Lastpage

730

Abstract

Strong crescent bond and strong tail bond are crucial for maintaining reliability and bondability of the wire bond and stability of the bonding process, respectively. This study investigates the optimization of tail breaking force and pull force of the crescent bond with insulated X-Wire^TM. The pull force and the tail breaking force are individually optimized by an iteration method. The results are compared with the results of bare Au wire. Ultrasonic power which is a measure of ultrasonic amplitude, combined with a cleaning stage during bonding plays a significant role in initiating the removal of the insulated layer of X-Wire^TM during the crescent bonding process. The pull force and the tail breaking force of insulated X-Wire^TM are 91.4 plusmn 11.78 mN and 59.15 plusmn 5.35 mN, comparable to those of bare Au wire.

Keywords

bonding processes; gold; reliability; wires; Au; X-Wire^TM; bondability; crescent bonding process stability; insulated gold wire; iteration method; pull force; tail bond; tail breaking force optimization; ultrasonic amplitude; ultrasonic power; wire bond reliability; Bonding forces; Bonding processes; Cable insulation; Gold; Maintenance; Optimization methods; Power measurement; Stability; Tail; Wire;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Packaging Technology Conference, 2007. EPTC 2007. 9th

Conference_Location

Singapore

Print_ISBN

978-1-4244-1323-2

Electronic_ISBN

978-1-4244-1323-2

Type

conf

DOI

10.1109/EPTC.2007.4469818

Filename

4469818