Title :
Advanced packaging technologies on 3D stacked LSI utilizing the micro interconnections and the layered microthin encapsulation
Author :
Tomita, Yoshihiro ; Morifuji, Tadahiro ; Ando, Tatsuya ; Tago, Masamoto ; Kajiwara, Ryoichi ; Nemoto, Yoshihiko ; Fujii, Tomonori ; Kitayama, Yoshifumi ; Takahashi, Kenji
Author_Institution :
Dept. of Electron. Syst. Integration Technol. Res., Tsukuba Res. Center, Ibaraki, Japan
Abstract :
The advanced 3D stacking technologies are discussed in this paper. They are the microbumping in 20 μm pitch, the basic processes of the advanced bonding processes for the high precision and the reliable interconnections, the novel technologies to encapsulate the layered microthin gaps less than 10 μm, and the non-destructive inspection. These technologies are confirmed to realize the 3D stacked LSI structure, and it will be expanded to the advanced system packaging technologies in the near future
Keywords :
encapsulation; inspection; integrated circuit bonding; integrated circuit interconnections; integrated circuit packaging; large scale integration; 3D stacked LSI structure; bonding process; layered microthin encapsulation; micro interconnection; microbumping; nondestructive inspection; packaging technology; Bonding processes; Copper; Electrodes; Electronics packaging; Encapsulation; Etching; Gold; Large scale integration; Packaging machines; Stacking;
Conference_Titel :
Electronic Components and Technology Conference, 2001. Proceedings., 51st
Conference_Location :
Orlando, FL
Print_ISBN :
0-7803-7038-4
DOI :
10.1109/ECTC.2001.927748
