Title :
Electronics packaging-a graduate course for Rutgers University School of Electrical and Computer Engineering
Author :
Caggiano, Michael F.
Author_Institution :
Dept. of Electr. & Comput. Eng., Rutgers Univ., Piscataway, NJ, USA
Abstract :
In this talk I will profile a course in electronic packaging that I am introducing for the spring semester 2001 at Rutgers University Graduate School of Electrical and Computer Engineering. Packaging and its effects on the electrical signal integrity of electronic devices are not addressed in any of the existing courses at Rutgers. Electronic noise and signal distortion are introduced in Transistor Circuit Design and Integrated Transistor Circuit Design. However, the proposed course Electronics Packaging will deal with the electrical characterization and modeling of the parasitic of integrated circuit packaging. The course will be targeted to the general graduate population of Master´s students and industry part time graduate students that have a background in circuit analysis. Ph.D. students in Solid State and VLSI design will also find the course useful due to the modeling content
Keywords :
educational courses; electronic engineering education; integrated circuit packaging; Rutgers University School of Electrical and Computer Engineering; electronic noise; electronic packaging; graduate educational course; integrated circuit; parasitics; signal distortion; signal integrity; Circuit analysis; Circuit synthesis; Distortion; Electronics packaging; Integrated circuit modeling; Integrated circuit noise; Integrated circuit packaging; Solid state circuits; Springs; Very large scale integration;
Conference_Titel :
Electronic Components and Technology Conference, 2001. Proceedings., 51st
Conference_Location :
Orlando, FL
Print_ISBN :
0-7803-7038-4
DOI :
10.1109/ECTC.2001.927757
