Title :
Double rectangular slot loop antenna for dual frequency
Author :
Jearapraditkul, P. ; Archevapanich, T. ; Purahong, B. ; Anantrasirichai, N. ; Sangaroon, O.
Author_Institution :
Fac. of Eng., King Mongkut´´s Inst. of Technol. Ladkrabang, Bangkok
Abstract :
This paper presents the technique for reducing size of double rectangular slot loop antenna fed by microstrip line for dual frequency. The two difference configurations of double rectangular slot loop antenna are proposed for comparison on bandwidth and size of antenna. These antennas are designed for dual frequency support WLAN system coverage IEEE 802.11b/g (2.4-2.4835 GHz), IEEE 802.11j (4.90-5.091), IEEE 802.11a (5.15-5.35 GHz), and IEEE 802.16d (5.7-5.9 GHz). The PCB-FR4 substrate with dielectric constant (epsivr) 4.5 of thickness 1.6 mm is chose for low cost. The simulation results of these slot antennas are analyzed by using method of moment (MoM) from IE3D software. In this case, the result of bandwidth for low frequency and high frequency of one antenna are 11.29% and 62%, and other are 6.1% and 75.5%, respectively. The size with ground plane of double slot loop antenna can be reduced 12.9% or can be reduced size of double slot loop antenna about 21.5% when set the new inner conductor.
Keywords :
loop antennas; method of moments; slot antennas; wireless LAN; IE3D software; IEEE 802.11a; IEEE 802.11b/g; IEEE 802.11j; IEEE 802.16d; PCB-FR4 substrate; double rectangular slot loop antenna; dual frequency support WLAN system; frequency 2.4 GHz to 2.4835 GHz; frequency 4.90 GHz to 5.091 GHz; frequency 5.15 GHz to 5.35 GHz; frequency 5.7 GHz to 5.9 GHz; method of moment; microstrip line; Analytical models; Bandwidth; Costs; Dielectric constant; Dielectric substrates; Frequency; Microstrip antennas; Moment methods; Slot antennas; Wireless LAN; double rectangular slot loop antenna; dual band; dual frequency; slot loop antenna;
Conference_Titel :
SICE Annual Conference, 2008
Conference_Location :
Tokyo
Print_ISBN :
978-4-907764-30-2
Electronic_ISBN :
978-4-907764-29-6
DOI :
10.1109/SICE.2008.4655251