A hands-on multi-disciplinary product development course for micro systems packaging education at Georgia Tech

A cross-disciplinary two-part Design-Build-Operate (DBO) program has recently been developed by the Packaging Research Center (PRC) at Georgia Institute of Technology. This program enables undergraduate and graduate students to gain hands-on experience in design, fabrication processes, material systems, electrical testing, flip-chip assembly, thermal management, and reliability assessment. The entire program is offered in two semesters. The first course, DBO1, covers the fundamentals of substrate fabrication processes and is augmented by an interactive multimedia education presentation that makes the course material remotely accessible through the Internet. The second course, DBO2, encompasses electronics manufacturing processes, material systems, testing, thermal management and reliability assessment