Characteristics of Amplifier-integrated 40 Gbps Optical Receiver and Transmitter Modules

Author

Choi, Kwang-Seong ; Yun, Ho-Gyeong ; Kwon, Yong-Hwan ; Choe, Joong-Seon ; Moon, Jong-Tae

Author_Institution

ETRI, Daejeon

fYear

2007

fDate

10-12 Dec. 2007

Firstpage

604

Lastpage

608

Abstract

We developed amplifier-integrated 40 Gbps optical receiver and transmitter module. The packaging technologies for the high-speed optical module are discussed and applied to develop the modules. For the optical receiver, the design and 40 Gbps NRZ eye diagrams are reported. For the optical transmitter, the manufacturability of wedge bonding to suppress the high-frequency resonance was investigated, and the electrical-to-optical (E/O) response of the module was measured.

Keywords

electro-optical devices; electronics packaging; integrated optoelectronics; modules; optical interconnections; optical receivers; optical transmitters; NRZ eye diagrams; amplifier-integrated optical receiver modules; amplifier-integrated optical transmitter modules; bit rate 40 Gbit/s; electrical-to-optical response; high-frequency resonance suppression; high-speed optical module; packaging technologies; wedge bonding; High speed optical techniques; Manufacturing; Optical amplifiers; Optical design; Optical receivers; Optical signal processing; Optical transmitters; Packaging; Semiconductor optical amplifiers; Stimulated emission;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Packaging Technology Conference, 2007. EPTC 2007. 9th

Conference_Location

Singapore

Print_ISBN

978-1-4244-1323-2

Electronic_ISBN

978-1-4244-1323-2

Type

conf

DOI

10.1109/EPTC.2007.4469829

Filename

4469829