• DocumentCode
    3162759
  • Title

    A high speed systolic architecture for labeling connected components in an image

  • Author

    Ranganathan, N. ; Mehrotra, R. ; Subramaniam, S.

  • Author_Institution
    Dept. of Comput. Sci. & Eng., Univ. of South Florida, Tampa, FL, USA
  • fYear
    1991
  • fDate
    2-5 Dec 1991
  • Firstpage
    818
  • Lastpage
    825
  • Abstract
    Connected components detection and labeling is an essential step in many image analysis techniques. The efficiency of the connected components labeling algorithm is critical for many image processing and machine vision applications that require real time response. The advances in the areas of parallel processing and VLSI technology can be exploited in designing hardware algorithms of high speed and throughput. The authors propose a systolic algorithm and architecture for finding connected components in an image. The architecture is simple and can be implemented as a special purpose VLSI chip. Although, the algorithm has a time complexity of O(N2), this is in terms of the actual clock cycle which is estimated as 25 nano seconds. The proposed hardware can process a 128×128 image on 0.85 msec and uses 128 processors where as the MPP requires 94.6 msec with 16384 processors. The only special purpose hardware that exists due to X.D. Yang (1988) requires 300 msec to label a 512×512 image which can be accomplished in about 13.5 msec using the authors´ proposed hardware
  • Keywords
    computational complexity; computer vision; systolic arrays; VLSI technology; hardware algorithms; high speed systolic architecture; image; image processing; labeling connected components; machine vision; real time response; systolic algorithm; time complexity; Algorithm design and analysis; Clocks; Hardware; Image analysis; Image processing; Labeling; Machine vision; Parallel processing; Throughput; Very large scale integration;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Parallel and Distributed Processing, 1991. Proceedings of the Third IEEE Symposium on
  • Conference_Location
    Dallas, TX
  • Print_ISBN
    0-8186-2310-1
  • Type

    conf

  • DOI
    10.1109/SPDP.1991.218236
  • Filename
    218236