Title :
Dynamic Testing of Solder Joint Strength under Compression, Tension and Shearing
Author :
Liu, J.F. ; Shim, V.P.W. ; Tan, V.B.C. ; Lee, Tim K.
Author_Institution :
Nat. Univ. of Singapore, Singapore
Abstract :
Studies on strain rate sensitivity of solder joints at high rates are relatively scarce. This investigation explores the possibility of establishing an experimental technique using a split Hopkinson bar to test single solder specimens. Computational simulation of tests on a cylindrical specimen the size of the solder ball is also performed to validate the assumption of one dimensional wave propagation as well as accuracy of stress-strain data derived. Tests on actual 0.24 mm diameter solder balls show good repeatability of results, confirming the feasibility of applying the SHB technique. Average dynamic stress-strain curves for strain rates ranging from 102/s to 103/s were obtained and compared with average responses corresponding to quasi-static strain rates of 10-3 /s and 1/s for compression, tension and shear loading. Rate sensitivity of the solder ball response is observed.
Keywords :
compressive testing; electronics packaging; mechanical strength; solders; stress-strain relations; SHB technique; compression test; computational simulation; electronic packaging; one dimensional wave propagation; quasistatic strain rates; shear loading test; solder ball response; solder ball sensitivity; solder joint dynamic testing; solder joint strength; split Hopkinson bar; strain rate sensitivity; stress-strain curves; stress-strain data; Capacitive sensors; Composite materials; Electronics packaging; Integrated circuit packaging; Joining materials; Manufacturing; Shearing; Soldering; Strain measurement; Testing;
Conference_Titel :
Electronics Packaging Technology Conference, 2007. EPTC 2007. 9th
Conference_Location :
Singapore
Print_ISBN :
978-1-4244-1323-2
Electronic_ISBN :
978-1-4244-1323-2
DOI :
10.1109/EPTC.2007.4469839
