Title :
A Compliant and Creep Resistant SAC-Al(Ni) Alloy
Author :
Huang, Benlih ; Hwang, Hong-Sik ; Lee, Ning-Cheng
Author_Institution :
Indium Corp. of America, Clinton
Abstract :
Addition of Al into SAC alloys reduces the number of hard Ag3Sn and Cu6Sn5 IMC particles, and forms larger, softer non-stoichiometric AlAg and AlCu particles. This results in a significant reduction in yield strength, and also causes some moderate increase in creep rate. For high Ag SAC alloys, adding Al 0.1-0.6% to SAC alloys is most effective in softening, and brings the yield strength down to the level of SAC105 and SAC1505, while the creep rate is still maintained at SAC305 level. Addition of Ni results in formation of large (Ni,Cu)3Sn4 IMC particles and loss of Cu6Sn5 particles. This also causes softening of SAC alloys, although to a less extent than that of Al addition. Addition of Al also drives the microstructure to shift from near-ternary SnAgCu eutectic toward combination of eutectic SnAg and eutectic SnCu. Addition of Ni drives shifting toward eutectic SnAg. For SAC+Al+Ni alloys, the pasty range and liquidus temperature are about 4degC less than that of SAC 105 or SAC 15 05 if the addition quantity is less than about 0.6%. Addition of Al and Ni also results in a slight decrease in modulus and elongation at break, although the tensile strength is not affected.
Keywords :
aluminium alloys; copper alloys; creep; crystal microstructure; elastic moduli; elongation; eutectic alloys; nickel alloys; silver alloys; solders; tensile strength; tin alloys; SAC alloys; SnAgCu-AlNi; creep resistant alloy; elastic modulus; elongation; intermetallic particles; lead-free SAC solders; liquidus temperature; microstructure; nonstoichiometric particles; tensile strength; ternary eutectic alloys; yield strength; Additives; Aluminum alloys; Application software; Creep; Indium; Lead; Microstructure; Nickel alloys; Softening; Temperature distribution; Al; Ni; SAC; compliant; creep resistant; lead-free; soften; solder;
Conference_Titel :
Electronics Packaging Technology Conference, 2007. EPTC 2007. 9th
Conference_Location :
Singapore
Print_ISBN :
978-1-4244-1323-2
Electronic_ISBN :
978-1-4244-1323-2
DOI :
10.1109/EPTC.2007.4469840