Title :
Full wave analysis of planar interconnect structures using FDTD-SPICE
Author :
Orhanovic, N. ; Raghuram, R. ; Matsui, N.
Author_Institution :
Appl. Simulation Technol., San Jose, CA, USA
Abstract :
This paper describes a full wave approach for analyzing planar interconnect structures, such as power distribution systems in printed circuit boards and multichip modules, using a tightly coupled combination of FDTD and SPICE. The technique enhances the present hybrid full wave circuit methods in terms of robustness and efficiency. The method is applied to a few sample problems to illustrate its accuracy and versatility
Keywords :
SPICE; finite difference time-domain analysis; interconnections; multichip modules; printed circuits; FDTD-SPICE; circuit simulation; hybrid full-wave analysis; multichip module; planar interconnect structure; power distribution system; printed circuit board; Coupling circuits; Finite difference methods; Integrated circuit interconnections; Multichip modules; Power distribution; Power system interconnection; Printed circuits; Robustness; SPICE; Time domain analysis;
Conference_Titel :
Electronic Components and Technology Conference, 2001. Proceedings., 51st
Conference_Location :
Orlando, FL
Print_ISBN :
0-7803-7038-4
DOI :
10.1109/ECTC.2001.927772
