Title :
Testing Interface Thermal Resistance
Author_Institution :
Budapest Univ. of Technol. & Econ., Budapest
Abstract :
The paper presents some recent trends in TIM material development, and outlines the state of the art in testing interface thermal resistance values. After presenting the trends in TIM material development first the available experimental techniques are presented shortly, and then the currently available industrial methods are discussed with more details. The paper finally presents some promising developments in finding better resolution high throughput methods to solve the challenging problem of measuring very small thermal resistance values in electronics applications.
Keywords :
integrated circuit packaging; materials testing; thermal management (packaging); thermal resistance measurement; TIM material; electronics applications; electronics packages; heat dissipation; interface thermal resistance testing; material testing; miniaturization; semiconductor packages; Conducting materials; Electronic packaging thermal management; Heat transfer; Integrated circuit packaging; Materials testing; Resistance heating; Semiconductor materials; Thermal conductivity; Thermal factors; Thermal resistance;
Conference_Titel :
Electronics Packaging Technology Conference, 2007. EPTC 2007. 9th
Conference_Location :
Singapore
Print_ISBN :
978-1-4244-1323-2
Electronic_ISBN :
978-1-4244-1323-2
DOI :
10.1109/EPTC.2007.4469842
