DocumentCode :
3163047
Title :
RF characterization of planar dipole antenna for on-chip integration with GaAs-based schottky diode
Author :
Mustafa, Farahiyah ; Hashim, Abdul Manaf ; Parimon, Norfarariyanti ; Abd Rahman, Shaharin Fadzli ; Abdul Rahman, Abdul Rahim ; Osman, Mohd Nizam
Author_Institution :
Mater. Innovations & Nanoelectron. Res. Group, Univ. Teknol. Malaysia, Skudai, Malaysia
fYear :
2009
fDate :
7-10 Dec. 2009
Firstpage :
571
Lastpage :
574
Abstract :
The design and RF characteristics of planar dipole antenna facilitated with coplanar waveguide structure was presented. The dipole antennas were fabricated on semi-insulated GaAs substrates by using standard photolithography and lift-off process. As expected, it can be seen that the fundamental resonant frequency shift to higher frequency when the length of antenna decreases. Interestingly, the resonant frequencies of antenna are almost unchanged with the variation of antenna width and metal thickness. The width of dipole antenna and metal thickness only has an effect on the magnitude of return loss where the magnitude increases to more negative value with the increase of width and decrease of metal thickness. One of the most promising applications of our proposed dipole antenna is the capability to be integrated directly with AlGaAs/GaAs Schottky diode without any insertion of matching circuit between them.
Keywords :
Schottky diodes; coplanar waveguides; dipole antennas; gallium arsenide; planar antennas; GaAs; GaAs-based Schottky diode; RF characterization; coplanar waveguide structure; lift-off process; on-chip integration; photolithography process; planar dipole antenna; Antenna feeds; Circuits; Coplanar waveguides; Dielectric substrates; Dipole antennas; Gallium arsenide; Radio frequency; Schottky diodes; Technological innovation; Transmission line antennas; AlGaAs/GaAs; Dipole antenna; HEMT; Schottky diode; coplanar waveguide; semiinsulated GaAs;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microwave Conference, 2009. APMC 2009. Asia Pacific
Conference_Location :
Singapore
Print_ISBN :
978-1-4244-2801-4
Electronic_ISBN :
978-1-4244-2802-1
Type :
conf
DOI :
10.1109/APMC.2009.5384163
Filename :
5384163
Link To Document :
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