Title :
Development of 3-dimensional module package, “System Block Module”
Author :
Imoto, Takashi ; Matsui, Mikio ; Takubo, Chiaki ; Akejima, Shuzo ; Kariya, Takashi ; Nishikawa, Tatsuya ; Enomoto, Ryo
Author_Institution :
Dept. of Adv. Packaging Eng., Toshiba Corp., Kawasaki, Japan
Abstract :
As the mobile electronics equipment moves toward higher performance and miniaturizing, each IC package is required to be stacked for saving a package mounting area on a system board. This paper describes a newly developed 3-dimensional module package using the technology of the silicon device thinning, micro flip chip bonding and two types of via connection of print circuit board for vertical wirings. These technology has realized the high density packaging of over 4 ICs stacking for practical use
Keywords :
flip-flops; integrated circuit packaging; modules; IC package; Si; System Block Module; micro flip chip bonding; mobile electronic equipment; print circuit board; silicon device thinning; three-dimensional module package; vertical wiring; via connection; Bonding; Electronic equipment; Electronics packaging; Flip chip; Integrated circuit packaging; Packaging machines; Printed circuits; Silicon devices; Stacking; Wiring;
Conference_Titel :
Electronic Components and Technology Conference, 2001. Proceedings., 51st
Conference_Location :
Orlando, FL
Print_ISBN :
0-7803-7038-4
DOI :
10.1109/ECTC.2001.927782
