An integrated, wireless microinstrument for monitoring skin temperature

Author

Salman, Z.K. ; Jones, S.H. ; Weikle, R.M. ; Aylor, J.H.

Author_Institution

Dept. of Electr. Eng., Virginia Univ., Charlottesville, VA, USA

fYear

1996

fDate

23-27 Sep 1996

Firstpage

107

Lastpage

110

Abstract

This paper describes the initial design, construction and testing of an integrated, wireless, temperature microsensor designed to monitor skin temperature and transmit the information to a local receiver using a 350 MHz carrier frequency. The sensor chip measures 4.6 mm by 6.8 mm and is fully self-contained, incorporating the sensing circuitry as well as a microantenna on chip. The chip is fabricated in a 2.0 micron, twin-metal, twin-poly, N-well, BiCMOS process technology provided by the DARPA MOSIS fabrication service

Keywords

BiCMOS integrated circuits; application specific integrated circuits; biomedical electronics; biomedical equipment; biomedical telemetry; biothermics; electric sensing devices; patient monitoring; radiotelemetry; temperature measurement; 2 micron; 350 MHz; DARPA MOSIS fabrication service; N-well BiCMOS process technology; integrated wireless microinstrument; onchip microantenna; onchip sensing circuitry; sensor chip; skin temperature monitoring; temperature microsensor; twin-metal twin-poly process; Circuit testing; Frequency; Integrated circuit measurements; Microsensors; Monitoring; Semiconductor device measurement; Skin; Temperature measurement; Temperature sensors; Wireless sensor networks;

fLanguage

English

Publisher

ieee

Conference_Titel

ASIC Conference and Exhibit, 1996. Proceedings., Ninth Annual IEEE International

Conference_Location

Rochester, NY

ISSN

1063-0988

Print_ISBN

0-7803-3302-0

Type

conf

DOI

10.1109/ASIC.1996.551972

Filename

551972