Title :
Interconnects for Buried W-Band MMICs Using Novel System-in-Package Technology
Author :
Richter, Marius D. ; Becker, Karl-F ; Böttcher, Lars ; Schneider, Martin
Author_Institution :
Dept. of RF & Microwave Eng., Univ. of Bremen, Bremen
Abstract :
A novel system-in-package technology has been developed which enables to bury active 77 GHz chips inside a printed circuit board (PCB). The chips are connected to an RF substrate on top of the PCB using microvias. To evaluate the performance of these interconnects, silicon daisy chain chips with coplanar lines are buried inside a PCB. Simulation and measurement data are compared. The embedding technology proposed offers great opportunities for a very broad range of frequencies and applications as well as a large potential for cost reduction.
Keywords :
MMIC; integrated circuit interconnections; printed circuits; system-in-package; PCB; buried W-Band MMICs; coplanar lines; embedding technology; frequency 77 GHz; interconnects; microvias; printed circuit board; silicon daisy chain chips; system-in-package technology; Bonding; Costs; Drilling; Integrated circuit interconnections; MMICs; Printed circuits; Radio frequency; Substrates; Wire; Wiring;
Conference_Titel :
Microwave Conference, 2009 German
Conference_Location :
Munich
Print_ISBN :
978-3-9812668-0-1
Electronic_ISBN :
978-3-8007-3150-3
DOI :
10.1109/GEMIC.2009.4815915
