• DocumentCode
    3163341
  • Title

    A new type of package incorporating a thin AlN heater for planar lightwave circuit devices

  • Author

    Saito, Hirohisa ; Nagai, Masaki ; Hirose, Yoshiyuki ; Tatoh, Nobuyoshi ; Seki, Morihiro ; Saitou, Masahide ; Tomikawa, Tadashi ; Yamanaka, Shosaku

  • Author_Institution
    Itami Res. Labs., Sumitomo Electr. Ind. Ltd., Hyogo, Japan
  • fYear
    2001
  • fDate
    2001
  • Firstpage
    648
  • Lastpage
    654
  • Abstract
    We have developed a new type of package for planar lightwave circuit (PLC) devices. An AlN heater was incorporated into a package in order to miniaturize the overall package size and to improve its thermal properties. In this paper, we evaluate the thermal and mechanical properties of the package. We successfully fabricated a thin package (8.5 mm in thickness), which is as thin as the butterfly package used for laser diodes. We observed that the temperature uniformity within the temperature-controlled area on the surface of the AlN heater was within 1°C, and that the temperature stability of the surface of the AlN heater was within 0.4°C when the ambient temperature was varied between -10°C and 70°C. We also found that our AlN heater had very good reliability. Fluctuations in the resistance of the AlN heater were within 0.3% after holding at 85°C and 85% RH for 5000 hours, with or without a bias current (1 A) at the heater. Furthermore, this package had high durability against mechanical vibration, mechanical shock and thermal shock
  • Keywords
    aluminium compounds; heating elements; integrated optics; packaging; -10 to 70 C; 8.5 mm; AlN; AlN heater; mechanical properties; mechanical shock; mechanical vibration; optical properties; package; planar lightwave circuit device; reliability; resistance fluctuations; temperature control; temperature stability; temperature uniformity; thermal properties; thermal shock; Circuits; Diode lasers; Electric shock; Mechanical factors; Packaging; Programmable control; Resistance heating; Stability; Surface resistance; Temperature;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 2001. Proceedings., 51st
  • Conference_Location
    Orlando, FL
  • ISSN
    0569-5503
  • Print_ISBN
    0-7803-7038-4
  • Type

    conf

  • DOI
    10.1109/ECTC.2001.927798
  • Filename
    927798