Title :
Design of a multichip module containing a 12 Way S/390 microprocessor subsystem
Author_Institution :
Processor Subsyst. Dev., IBM Lab., Boeblingen, Germany
Abstract :
This paper presents the development strategy of a high performance S/390 CMOS microprocessor subsystem packaged on a 127 mm MCM. The MCM houses the complete processor core components like BU, FPU, L1-cache, L2-cache, bus-switch and DMA-controller. This multichip module set another milestone regarding miniaturization complexity and testability. The MCM-internal-net count was above 10.000 while the signals leaving the MCM passed 1700. Chipsize is up to 14.5 mm×14.5 mm
Keywords :
CMOS digital integrated circuits; integrated circuit design; microprocessor chips; multichip modules; 12 Way S/390 CMOS microprocessor subsystem; design; multichip module; packaging; CMOS process; CMOS technology; Chip scale packaging; DSL; Design methodology; Laboratories; Logic testing; Microprocessors; Multichip modules; Shape control;
Conference_Titel :
ASIC Conference and Exhibit, 1996. Proceedings., Ninth Annual IEEE International
Conference_Location :
Rochester, NY
Print_ISBN :
0-7803-3302-0
DOI :
10.1109/ASIC.1996.551991
