Title :
The kinetics of formation of ternary intermetallic alloys in Pb-Sn and Cu-Ag-Sn Pb-free electronic joints
Author :
Zribi, A. ; Zavalij, L. ; Borgesen, P. ; Primavera, A. ; Westby, G. ; Cotts, E.J.
Author_Institution :
Dept. of Phys., State Univ. of New York, Binghamton, NY, USA
Abstract :
A simple model of the formation of Au0.1Ni0.1Sn0.8 in Pb-Sn solder/Ni interconnects is examined by numerical simulation. Previous experimental observation has shown that after reflow the interface consists of the Ni 3Sn4 alloy between Pb-Sn solder and Ni, with Au distributed through the PbSn solder ball. Au0.1Ni0.1 Sn0.8 was observed to form at the Pb-Sn solder/Ni3 Sn4 interface during annealing at 150°C in a number of studies. The numerical simulation was used to calculate the maximum flux of Au to the interface, and with the assumption that this Au was immediately incorporated in to Au0.1Ni0.1Sn0.8 a maximum rate of formation of Au0.1Ni0.1Sn0.8 was calculated. This rate was found to be similar to measured rates of formation of Au0.1Ni0.1Sn0.8 from two different studies. The formation of(CuNi)6SnS in Sn-Ag-Cu/Ni solder interconnects was discussed within the context of these observations
Keywords :
annealing; integrated circuit packaging; integrated circuit reliability; reflow soldering; 150 degC; CuAgSn; PbSn; annealing; lead-free electronic joints; maximum flux; numerical simulation; reflow; solder interconnects; ternary intermetallic alloys; Gold alloys; Intermetallic; Kinetic theory; Metallization; Nickel alloys; Numerical simulation; Oxidation; Soldering; Temperature; Tin;
Conference_Titel :
Electronic Components and Technology Conference, 2001. Proceedings., 51st
Conference_Location :
Orlando, FL
Print_ISBN :
0-7803-7038-4
DOI :
10.1109/ECTC.2001.927807
