DocumentCode
3163590
Title
Notice of Retraction
3-D warpage measurement of silicon wafer
Author
Wei Zhang ; Fulong Zhu ; Shao Song ; Honghai Zhang ; Sheng liu ; Chuanqion Sun
Author_Institution
Inst. of Microsyst., HuaZhong Univ. of Sci. & Technol., Wuhan, China
fYear
2011
fDate
8-10 Aug. 2011
Firstpage
3603
Lastpage
3605
Abstract
Notice of Retraction
After careful and considered review of the content of this paper by a duly constituted expert committee, this paper has been found to be in violation of IEEE´s Publication Principles.
We hereby retract the content of this paper. Reasonable effort should be made to remove all past references to this paper.
The presenting author of this paper has the option to appeal this decision by contacting TPII@ieee.org.
The warpage measurement of silicon wafers is an important main part in semiconductor industry. Shadow moiré and four-step phase shift technique ware used to obtain the out-of-displacement, and the max warpage of the silicon wafer with the size of 20mm×20mm and 0.5mm thickness can be shown in the 3-D warpage result.
After careful and considered review of the content of this paper by a duly constituted expert committee, this paper has been found to be in violation of IEEE´s Publication Principles.
We hereby retract the content of this paper. Reasonable effort should be made to remove all past references to this paper.
The presenting author of this paper has the option to appeal this decision by contacting TPII@ieee.org.
The warpage measurement of silicon wafers is an important main part in semiconductor industry. Shadow moiré and four-step phase shift technique ware used to obtain the out-of-displacement, and the max warpage of the silicon wafer with the size of 20mm×20mm and 0.5mm thickness can be shown in the 3-D warpage result.
Keywords
semiconductor device manufacture; semiconductor industry; 3D warpage measurement; four-step phase shift technique; semiconductor industry; shadow moire; silicon wafer; Extraterrestrial measurements; Gratings; Holography; Optical imaging; Optical variables measurement; Semiconductor device measurement; Silicon; Shadow moiré; silicon wafer; warpage;
fLanguage
English
Publisher
ieee
Conference_Titel
Artificial Intelligence, Management Science and Electronic Commerce (AIMSEC), 2011 2nd International Conference on
Conference_Location
Dengleng
Print_ISBN
978-1-4577-0535-9
Type
conf
DOI
10.1109/AIMSEC.2011.6010064
Filename
6010064
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