Title :
50 GHz broadband SMT package for microwave applications
Author :
Yoshida, Katsuyuki ; Shirasaki, Takayuki ; Matsuzono, Seigo ; Makihara, Chihiro
Author_Institution :
Semicond. Components Group, Kyocera Corp., Kagoshima, Japan
Abstract :
Shows and explains the key points of the simulation and design technologies for high frequency SMT package. Then, we introduce practical examples of packages designed for high frequency by using simulation technology in order to improve the transmission properties of the package. We have manufactured prototype samples of such packages and confirmed the results of simulation by actual measurements. The measurement results show S11<-15dB and S21<-1dB per port up to 50 GHz (including the board interface). Therefore we introduce a surface mount BGA package suitable for up to 50 GHz. As for package material, we used low loss LTCC (Low Temperature Cofired Ceramic [GL560]), (Er=6.0, tangent delta= 0.0023 at 10 GHz) in order to lower the capacitance at the ball portion
Keywords :
MMIC; ball grid arrays; capacitance; ceramic packaging; integrated circuit packaging; surface mount technology; 50 GHz; BGA package; board interface; broadband SMT package; capacitance; low loss LTCC; microwave applications; transmission properties; Ceramics; Costs; Degradation; Frequency; Integrated circuit packaging; Millimeter wave communication; Millimeter wave technology; Propagation losses; Semiconductor device packaging; Surface-mount technology;
Conference_Titel :
Electronic Components and Technology Conference, 2001. Proceedings., 51st
Conference_Location :
Orlando, FL
Print_ISBN :
0-7803-7038-4
DOI :
10.1109/ECTC.2001.927815
