Title :
Thermal Interactions Between Electromigration Test Structures
Author :
Schafft, Harry A. ; Albers, John
Author_Institution :
National Bureau Of Standards
Keywords :
Electrical resistance measurement; Electromigration; Electronic equipment testing; Electronic packaging thermal management; Heat sinks; Metallization; Semiconductor device measurement; Temperature; Thermal resistance; Thermal stresses;
Conference_Titel :
Microelectronic Test Structures, 1988. ICMTS. Proceedings of the 1988 IEEE International Conference on
Conference_Location :
Long Beach, CA, USA
DOI :
10.1109/ICMTS.1988.672948
