• DocumentCode
    3163665
  • Title

    Thermal Interactions Between Electromigration Test Structures

  • Author

    Schafft, Harry A. ; Albers, John

  • Author_Institution
    National Bureau Of Standards
  • fYear
    1988
  • fDate
    22-23 Feb. 1988
  • Firstpage
    132
  • Lastpage
    137
  • Keywords
    Electrical resistance measurement; Electromigration; Electronic equipment testing; Electronic packaging thermal management; Heat sinks; Metallization; Semiconductor device measurement; Temperature; Thermal resistance; Thermal stresses;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microelectronic Test Structures, 1988. ICMTS. Proceedings of the 1988 IEEE International Conference on
  • Conference_Location
    Long Beach, CA, USA
  • Type

    conf

  • DOI
    10.1109/ICMTS.1988.672948
  • Filename
    672948
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3163665