Title :
A hybrid high-speed silica-based planar lightwave circuit platform integrating a laser diode and a driver IC
Author :
Akahori, Y. ; Ohyama, T. ; Yanagisawa, M. ; Yamada, Y. ; Tsunetsugu, H. ; Akatsu, Y. ; Togashi, M. ; Mino, S. ; Shibata, Y.
Author_Institution :
NTT Opto-Electron. Labs., Ibaraki, Japan
Abstract :
We have developed silica-based planar lightwave circuit platform by integrating an LD array and a two-channel LD driver IC operating at 9 Gb/s. The combination of AuSn and In solder bumps enabled the flip-chip bonding of the LD array and the driver IC on the same platform
Keywords :
driver circuits; 9 Gbit/s; AuSn; In; In solder bumps; LD array; driver IC; flip-chip bonding; hybrid high-speed silica-based planar lightwave circuit platform; laser diode; laser diode integration; silica-based planar lightwave circuit platform; two-channel LD driver IC;
Conference_Titel :
Integrated Optics and Optical Fibre Communications, 11th International Conference on, and 23rd European Conference on Optical Communications (Conf. Publ. No.: 448)
Conference_Location :
Edinburgh
Print_ISBN :
0-85296-697-0
DOI :
10.1049/cp:19971564
