• DocumentCode
    3163800
  • Title

    Reducing power dissipation in low voltage flash memories

  • Author

    Luderman, Brenda L. ; Chang, Kuo-Tung ; Su, Jeffrey ; Cavins, Craig ; Pabst, John ; Yu, Tat-kwan ; Higman, Jack

  • Author_Institution
    Semicond. Products Sector, Motorola Inc., Austin, TX, USA
  • fYear
    1996
  • fDate
    23-27 Sep 1996
  • Firstpage
    305
  • Lastpage
    308
  • Abstract
    A new low voltage flash circuit model is presented. This SPICE model is used to identify techniques for reducing the average power dissipated in a flash memory during a programming cycle. The AND flash memory cell is used in this analysis. For a selected bitcell in a NOR block, the power dissipated is dominated by a band-to-band transient current. SPICE simulations show that this power can be reduced by decreasing the charge pump´s slew rate and the erase threshold voltage. In an unselected bitcell, the power dissipated is the sum of band-to-band and drain charging currents. Simulations show that this power can be reduced by increasing the positive word line bias applied to unselected bitcells in the NOR block
  • Keywords
    EPROM; PLD programming; SPICE; circuit analysis computing; equivalent circuits; integrated circuit modelling; integrated memory circuits; leakage currents; tunnelling; AND flash memory cell; LV flash circuit model; NOR block; SPICE model; SPICE simulations; band-to-band transient current; charge pump slew rate; drain charging current; erase threshold voltage; low voltage flash memories; positive word line bias; power dissipation; programming cycle; unselected bitcells; Charge pumps; Circuit simulation; Electrons; Flash memory; Lifting equipment; Low voltage; Power dissipation; SPICE; Semiconductor device measurement; Tunneling;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    ASIC Conference and Exhibit, 1996. Proceedings., Ninth Annual IEEE International
  • Conference_Location
    Rochester, NY
  • ISSN
    1063-0988
  • Print_ISBN
    0-7803-3302-0
  • Type

    conf

  • DOI
    10.1109/ASIC.1996.552016
  • Filename
    552016