High performance ball grid array utilizing flip chip bonding on buildup printed circuit board

Author

Yamanaka, Kimihiro ; Mori, Hiroyuki ; Tsukada, Yutaka

Author_Institution

IBM Japan Ltd., Tokyo, Japan

fYear

1997

fDate

13-15 Oct 1997

Firstpage

369

Lastpage

375

Abstract

A flip chip bonding on a buildup Printed Circuit Board (PCB) has been emerging in a chip carrier area. As chip performance has been improving rapidly, it is now required to have a high performance chip carrier. This paper demonstrates a Ball Grid Array (BGA) application where a flip chip bonding on a multiple buildup layer PCB has an essential electrical performance for a high performance chip which has more than 1000 I/Os and more than 128 bit bus operating at 100 MHz. The effect of a ground plane and a power/ground pick up path design on crosstalk and ground bounce is discussed using SLC-BGA. Also discussed is a package electrical performance comparing various package types. We conclude that flip chip bonding on multiple buildup layer PCB technology is essential for a high performance chip carrier

Keywords

crosstalk; flip-chip devices; integrated circuit packaging; printed circuit manufacture; 100 MHz; BGA; SLC-BGA; ball grid array; buildup printed circuit board; chip carrier area; crosstalk; flip chip bonding; ground plane; package electrical performance; package types; power/ground pick up path design; Application software; Bonding; Costs; Crosstalk; Dielectrics; Electronics packaging; Flip chip; Printed circuits; Production; Semiconductor device packaging;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Manufacturing Technology Symposium, 1997., Twenty-First IEEE/CPMT International

Conference_Location

Austin, TX

ISSN

1089-8190

Print_ISBN

0-7803-3929-0

Type

conf

DOI

10.1109/IEMT.1997.626947

Filename

626947