DocumentCode
3164211
Title
Analysis of line edge roughness using probability process model for chemically amplified resists
Author
Fukuda, H.
Author_Institution
Central Res. Lab., Hitachi Ltd., Tokyo, Japan
fYear
2002
fDate
6-8 Nov. 2002
Firstpage
76
Lastpage
77
Abstract
Various factors are considered as causes of line edge roughness (LER), such as fluctuation in energy particle density (shot noise), local acid density, solubility of polymer molecules and their size. Most analyses/simulations as for resist patterns assumes resist as continuous matter, and its solubility (dissolution rate) is defined as a continuous function of process condition such as exposure dose. In reality, however, resist pattern is a large cluster of polymer molecules and solubility of each molecule takes only two values (e.g. soluble or insoluble). Macroscopically observed dissolution rate is considered to represent probability of main reaction and developer percolation. In this sense, LER means fluctuation in acid catalyzed (main) reaction to determine molecular solubility combined with developer percolation. Here, the developer percolation also depends on geometrical arrangement of main reaction. In this paper, line edge roughness (LER) in chemically amplified resists (CARs) is analyzed as a fluctuation in acid catalyzed reaction to determine molecular solubility and developer percolation.
Keywords
resists; solubility; surface topography; chemically amplified resists; continuous function; developer percolation; dissolution rate; energy particle density fluctuation; geometrical arrangement; line edge roughness; local acid density; polymer molecules solubility; probability process model; resist patterns; shot noise; Character generation; Chemical analysis; Chemical processes; Fluctuations; Kinetic theory; Laboratories; Pixel; Polymers; Resists; Solid modeling;
fLanguage
English
Publisher
ieee
Conference_Titel
Microprocesses and Nanotechnology Conference, 2002. Digest of Papers. Microprocesses and Nanotechnology 2002. 2002 International
Conference_Location
Tokyo, Japan
Print_ISBN
4-89114-031-3
Type
conf
DOI
10.1109/IMNC.2002.1178551
Filename
1178551
Link To Document