A New BCB Film Zero-Level Packaging for RF Devices

Author

Seok, S. ; Rolland, N. ; Rolland, P.A.

Author_Institution

IEMN/IRCICA, Villeneuve d´´Ascq

fYear

2006

fDate

10-15 Sept. 2006

Firstpage

1118

Lastpage

1121

Abstract

This paper presents a whole benzocyclobutene (BCB) film encapsulated 0-level packaging using a wafer level BCB bonding technique. Wafer-scale membrane transfer technique using silicon carrier wafers was used to make BCB membrane caps for encapsulation placed above the device wafers. The RF characteristics using coplanar waveguide (CPW) lines were measured to evaluate the effect of BCB film package. The insertion loss change of CPW lines by BCB membrane package is below 0.01 dB up to 90 GHz, while the glass packaged CPW lines show about 0.1 dB deviation from 20 GHz to 110 GHz

Keywords

bonding processes; coplanar waveguides; encapsulation; organic compounds; semiconductor device packaging; 20 to 110 GHz; BCB film package; BCB film zero-level packaging; BCB membrane caps; BCB membrane package; RF characteristics; RF devices; coplanar waveguide lines; encapsulated 0-level packaging; glass packaged CPW lines; insertion loss; silicon carrier wafers; wafer level BCB bonding; wafer-scale membrane transfer; whole benzocyclobutene film; Biomembranes; Coplanar waveguides; Encapsulation; Glass; Insertion loss; Packaging; Radio frequency; Silicon; Wafer bonding; Wafer scale integration; BCB; Coplanar; Packaging; RF; Wafer-level bonding;

fLanguage

English

Publisher

ieee

Conference_Titel

Microwave Conference, 2006. 36th European

Conference_Location

Manchester

Print_ISBN

2-9600551-6-0

Type

conf

DOI

10.1109/EUMC.2006.281152

Filename

4058021