DocumentCode
3164682
Title
Thermal research on material and structure of High-Power-LED module
Author
Guo, Minying
Author_Institution
Sch. of Art & Design, China Univ. of Min. & Technol., Xuzhou, China
fYear
2011
fDate
16-18 April 2011
Firstpage
2820
Lastpage
2823
Abstract
The high junction temperature of High-Power-LED and low heat-release have directly influence on light luminoue efficiency and device lifetime, so how to maintain the temperature in proper range and improve the function of heat-release, become the key issue for the industrialization of high-power-LED. In this paper, it is given that reducing thermal resistance is the best way to lower temperature of LED. Furthermore, the thermal performance of material, packaging and module structure have been analysed in details, In the end, by reasonable design, it shows two novel module structures and analyses their advantages in heat-release.
Keywords
light emitting diodes; modules; packaging; thermal resistance; heat release; high junction temperature; high-power-LED module; module structure; packaging; thermal resistance; Heating; Light emitting diodes; Lighting; Materials; Packaging; Temperature distribution; Thermal analysis; High-Power-LED; heat-release; material; module; structure;
fLanguage
English
Publisher
ieee
Conference_Titel
Consumer Electronics, Communications and Networks (CECNet), 2011 International Conference on
Conference_Location
XianNing
Print_ISBN
978-1-61284-458-9
Type
conf
DOI
10.1109/CECNET.2011.5769086
Filename
5769086
Link To Document