Title :
3D micro-cooled HPA package for RADAR application
Author :
Lanciano, Antonio ; Casano, Stefano ; Buttiglione, Roberta ; Fiorello, Anna Maria
Author_Institution :
Selex Sistemi Integrati S.p.A., Rome
Abstract :
A new challenging solution for an high power (75 W) module package (52mm times 52mm times 38mm) for radar application has been developed. The described module is integrated in a 3D package with an RF vertical interconnection and an embedded heat-pipe cooling system. This integrated solution will permit a lower junction temperature for the high power component compared with traditional ones
Keywords :
active networks; integrated circuit interconnections; integrated circuit packaging; microwave power amplifiers; radar equipment; 3D micro cooled; HPA package; active circuits; interconnections; microwave power amplifiers; packaging; radar application; Circuits; Cooling; Electromagnetic heating; Packaging; Power amplifiers; Radar applications; Radio frequency; Radiofrequency amplifiers; Temperature; Voltage; Active circuits; interconnections; microwave power amplifiers; packaging;
Conference_Titel :
Microwave Conference, 2006. 36th European
Conference_Location :
Manchester
Print_ISBN :
2-9600551-6-0
DOI :
10.1109/EUMC.2006.281186
