DocumentCode
3164893
Title
Micro electronic packaging technologies: status and trends
Author
Nieden, Theis Zur
Author_Institution
IBM Germany, Sindelfingen, Germany
fYear
1992
fDate
4-8 May 1992
Firstpage
292
Lastpage
297
Abstract
Reviews the status of today´s prevalent technologies for packaging microelectronic components for signal processing systems with an emphasis on high-performance computer applications. Some limits of standard hierarchical packaging schemes are discussed. Alternative novel chip packaging approaches like thin-film multichip carriers and direct chip attach methods are presented. Perspectives for some recent product applications are given.<>
Keywords
digital signal processing chips; packaging; reviews; direct chip attach methods; hierarchical schemes; high-performance computer applications; microelectronic components; packaging technologies; signal processing systems; thin-film multichip carriers; Application software; Computer applications; Data processing; Electronic packaging thermal management; Electronics packaging; High performance computing; Optical signal processing; Packaging machines; Semiconductor device packaging; Signal processing;
fLanguage
English
Publisher
ieee
Conference_Titel
CompEuro '92 . 'Computer Systems and Software Engineering',Proceedings.
Conference_Location
The Hague, Netherlands
Print_ISBN
0-8186-2760-3
Type
conf
DOI
10.1109/CMPEUR.1992.218418
Filename
218418
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