Title :
Micro electronic packaging technologies: status and trends
Author :
Nieden, Theis Zur
Author_Institution :
IBM Germany, Sindelfingen, Germany
Abstract :
Reviews the status of today´s prevalent technologies for packaging microelectronic components for signal processing systems with an emphasis on high-performance computer applications. Some limits of standard hierarchical packaging schemes are discussed. Alternative novel chip packaging approaches like thin-film multichip carriers and direct chip attach methods are presented. Perspectives for some recent product applications are given.<>
Keywords :
digital signal processing chips; packaging; reviews; direct chip attach methods; hierarchical schemes; high-performance computer applications; microelectronic components; packaging technologies; signal processing systems; thin-film multichip carriers; Application software; Computer applications; Data processing; Electronic packaging thermal management; Electronics packaging; High performance computing; Optical signal processing; Packaging machines; Semiconductor device packaging; Signal processing;
Conference_Titel :
CompEuro '92 . 'Computer Systems and Software Engineering',Proceedings.
Conference_Location :
The Hague, Netherlands
Print_ISBN :
0-8186-2760-3
DOI :
10.1109/CMPEUR.1992.218418
