Title :
Simulation methods and technologies for multichip modules
Author :
Reichl, Herbert ; Fotheringham, Gerhard
Author_Institution :
Tech. Univ. of Berlin, Germany
Abstract :
Concepts of multi-chip modules (MCMs) are discussed and simulation methods for their design are presented. The basic requirements for MCM materials and interconnection technologies are outlined. Signal transmission behavior and thermal problems are considered. A short survey of technologies for multilayers is given.<>
Keywords :
multichip modules; simulation; design; interconnection technologies; materials requirements; multi-chip modules; multilayers; signal transmission behaviour; simulation methods; thermal problems; Ceramics; Dielectric substrates; Integrated circuit interconnections; Multichip modules; Packaging; Silicon; Soldering; Thermal expansion; Thermal force; Water heating;
Conference_Titel :
CompEuro '92 . 'Computer Systems and Software Engineering',Proceedings.
Conference_Location :
The Hague, Netherlands
Print_ISBN :
0-8186-2760-3
DOI :
10.1109/CMPEUR.1992.218419
