DocumentCode
3164912
Title
Simulation methods and technologies for multichip modules
Author
Reichl, Herbert ; Fotheringham, Gerhard
Author_Institution
Tech. Univ. of Berlin, Germany
fYear
1992
fDate
4-8 May 1992
Firstpage
286
Lastpage
291
Abstract
Concepts of multi-chip modules (MCMs) are discussed and simulation methods for their design are presented. The basic requirements for MCM materials and interconnection technologies are outlined. Signal transmission behavior and thermal problems are considered. A short survey of technologies for multilayers is given.<>
Keywords
multichip modules; simulation; design; interconnection technologies; materials requirements; multi-chip modules; multilayers; signal transmission behaviour; simulation methods; thermal problems; Ceramics; Dielectric substrates; Integrated circuit interconnections; Multichip modules; Packaging; Silicon; Soldering; Thermal expansion; Thermal force; Water heating;
fLanguage
English
Publisher
ieee
Conference_Titel
CompEuro '92 . 'Computer Systems and Software Engineering',Proceedings.
Conference_Location
The Hague, Netherlands
Print_ISBN
0-8186-2760-3
Type
conf
DOI
10.1109/CMPEUR.1992.218419
Filename
218419
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